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0.02mm Ultra Fine Ag Wire Anti-Corrosion for Industrial Semiconductor Modules

0.02mm Ultra Fine Ag Wire Anti-Corrosion for Industrial Semiconductor Modules

ultra fine ag bonding wire

anti-corrosion semiconductor bonding wire

industrial ag wire for modules

Herkunftsort:

China

Markenname:

WINNER

Zertifizierung:

ISO9100

Modellnummer:

MW001

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Produktdetails
Produkttyp:
Bindungsdraht
Material:
Ag
Paket:
Spule
Oberflächenbeschaffenheit:
Hell
Leitfähigkeit:
98 %
Anwendung:
Halbleiterverpackung, Mikroelektronik, medizinische Geräte
Hervorheben:

ultra fine ag bonding wire

,

anti-corrosion semiconductor bonding wire

,

industrial ag wire for modules

Zahlungs-u. Verschiffen-Ausdrücke
Min Bestellmenge
1 Stk
Preis
999
Verpackung Informationen
Rollen, Neutrienverpackung oder mit OEM -Logo
Lieferzeit
5-8 Werktage
Zahlungsbedingungen
L/C, Western Union, T/T
Versorgungsmaterial-Fähigkeit
100000 Rollen pro Monat
Produkt-Beschreibung
0.02mm Ultra Fine Ag Wire Anti-Corrosion for Industrial Semiconductor Modules

Durable anti-corrosion property, long service life for industrial semiconductor integrated modules.
Product Description 
Silver (Ag) alloy bonding wires have excellent electrical and thermal conductivity. They are also effective wires for optical semiconductor devices such as LEDs as they have high reflectivity in the visible spectrum. In addition, as an alternative material for gold (Au) wires, costs can be reduced by approximately 80%.
Features
  • Reduce material cost with good bondability
  • High reflectivity in short wavelength range
  • Low Resistivity (SEC Type)
  • Soft FAB (SEC type)
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