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0.02mm High Current Load Pure Silver Wire IGBT Power Semiconductor Bonding Wire

0.02mm High Current Load Pure Silver Wire IGBT Power Semiconductor Bonding Wire

0.02mm pure silver bonding wire

high current IGBT bonding wire

power semiconductor silver wire

Herkunftsort:

China

Markenname:

WINNER

Zertifizierung:

ISO9100

Modellnummer:

MW001

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Produktdetails
Produkttyp:
Bindungsdraht
Material:
Ag
Paket:
Spule
Oberflächenbeschaffenheit:
Hell
Leitfähigkeit:
98 %
Anwendung:
Halbleiterverpackung, Mikroelektronik, medizinische Geräte
Hervorheben:

0.02mm pure silver bonding wire

,

high current IGBT bonding wire

,

power semiconductor silver wire

Zahlungs-u. Verschiffen-Ausdrücke
Min Bestellmenge
1 Stk
Preis
999
Verpackung Informationen
Rollen, Neutrienverpackung oder mit OEM -Logo
Lieferzeit
5-8 Werktage
Zahlungsbedingungen
L/C, Western Union, T/T
Versorgungsmaterial-Fähigkeit
100000 Rollen pro Monat
Produkt-Beschreibung
0.02mm High Current Load Pure Silver Wire IGBT Power Semiconductor Bonding Wire

Big current bearing capacity, widely adopted for IGBT high-power semiconductor bonding connection.
Product Description 
Silver (Ag) alloy bonding wires have excellent electrical and thermal conductivity. They are also effective wires for optical semiconductor devices such as LEDs as they have high reflectivity in the visible spectrum. In addition, as an alternative material for gold (Au) wires, costs can be reduced by approximately 80%.
Features
  • Reduce material cost with good bondability
  • High reflectivity in short wavelength range
  • Low Resistivity (SEC Type)
  • Soft FAB (SEC type)
Close-up view of high purity gold wire showing plating quality and surface texture Gold wire spool showing professional packaging and product storage Microscopic cross-section view of gold wire showing uniform structure and purity Gold wire being used in precision industrial application with specialized equipment

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